Leveraging In-Package Wireless Technology To Improve The Thermal Behavior Of 2.5D Chiplet-Based SoP

A technical paper titled “REMOTE: Re-thinking Job Mapping on Wi-fi 2.5D Programs-on-Package deal for Hotspot Removing” was printed by researchers at Swiss Federal Institute of Expertise Lausanne (EPFL) and College of Utilized Sciences and Arts of Western Switzerland (HES-SO).

Summary Excerpt

“In this work, we suggest a brand new process mapping heuristic that leverages in-package wi-fi know-how to enhance the thermal conduct of two.5D SoPs executing complicated functions. Combining system simulation and thermal modeling, our outcomes present that we will distribute computation in wi-fi 2.5D SoPs to cut back peak temperatures by as much as 24% by process mapping with a negligible efficiency affect.”

Discover the technical paper here. Revealed August 2023.

Medina Morillas, Rafael, Darong Huang, Giovanni Ansaloni, Marina Zapater Sancho, and David Atienza Alonso. “REMOTE: Re-thinking Job Mapping on Wi-fi 2.5 D Programs-on-Package deal for Hotspot Removing.” EPFL Infoscience. 2023.

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